Test Socket for HBM (High Bandwidth Memory)
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Brand
Mirtech
Grade / Type / Style
Test Socket for HBM
Main Ingredient Name
LCP, Cu, Gold, SUS304, Ultem
Weight
19kg
Receive processing
No
Minimum Order Quantity (MOQ)
1,000 piece
Provide samples
No
Product Condition
100% New
Main Export Market
Vietnam, United States, South Korea
Packaging
Packaging type
piece
Packaging Detail
1 product packaged in 1 carton box
Packaging dimensions (length x width x height)
500 millimeter x 350 millimeter x 250 millimeter
Packing weight
19 kg
B2B Sales Policy
Negotiable
Negotiable
Negotiable
Detailed description
Test Socket for HBM (High Bandwidth Memory)
The Test Socket for HBM is a specialized testing solution for High Bandwidth Memory (HBM), a core component in high-performance systems such as AI, HPC, and GPUs.
Designed to handle extremely high data transfer rates, this socket uses high-quality conductive materials and an optimized structure to ensure stable signals, reduce noise, and minimize power loss.
With its compatibility with ultra-small pitch, low profile, and support for multi-channel testing, the Test Socket for HBM enables semiconductor manufacturers to easily evaluate the performance and reliability of HBM chips before assembly. This is a crucial tool in the quality control and R&D chain of the modern semiconductor industry.
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